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TLP781/TLP781F
TOSHIBA Photocoupler GaAs IRED & Photo-Transistor
TLP781, TLP781F
Office Equipment Household Appliances Solid State Relays Switching Power Supplies Various Controllers Signal Transmission Between Different Voltage Circuits
TLP781 Unit in mm
The TOSHIBA TLP781 consists of a silicone photo-transistor optically coupled to a gallium arsenide infrared emitting diode in a four lead plastic DIP (DIP4) with having high isolation voltage (AC: 5kVRMS (min)). TOSHIBA * * * * * * * TLP781 : 7.62mm pitch type DIP4 TLP781F : 10.16mm pitch type DIP4 Collector-emitter voltage: 80V (min.) Current transfer ratio: 50% (min.) Rank GB: 100% (min.) Isolation voltage: 5000Vrms (min.) UL recognized: UL1577, file No. E67349 BSI approved: BS EN60065:2002 Approved no.8961 BS EN60950-1:2006 Approved no.8962 * * SEMKO approval: EN60950-1,EN60065 under plan Option(D4)type VDE approved : DIN EN60747-5-2 Certificate No. 40021173 (Note): When an EN60747-5-2 approved type is needed, Please designate "Option (D4)" Weight: 0.25g (typ.) TLP781F Unit in mm
TOSHIBA Weight: 0.25g (typ.)
*
Construction mechanical rating
7.62mm Pitch Standard Type Creepage distance Clearance Insulation thickness 6.5mm(min) 6.5mm(min) 0.4mm(min) 10.16mm Pitch TLPxxxF Type 8.0mm(min) 8.0mm(min) 0.4mm(min)
Pin Configurations (top view)
1 2 1 : Anode 2 : Cathode 3 : Emitter 4 : Collector 4 3
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TLP781/TLP781F
Current Transfer Ratio
Type Classi- fication (Note 1) (None) Rank Y Rank GR Rank BL TLP781 Rank GB Rank YH Rank GRL Rank GRH Rank BLL Current Transfer Ratio (%) (IC / IF) IF = 5mA, VCE = 5V, Ta = 25C Min Max 50 50 100 200 100 75 100 150 200 600 150 300 600 600 150 200 300 400 Marking Of Classification Blank, Y, Y+, YE,G, G+, B, B+,BL,GB YE GR BL GB Y+ G G+ B
(Note 1): Ex. rank GB: TLP781 (GB) (Note 2): Application type name for certification test, please use standard product type name, i. e. TLP781 (GB): TLP781
Absolute Maximum Ratings (Ta = 25C)
Characteristic Forward current Forward current derating(Ta 39C) Pulse forward current LED Power dissipation Power dissipation derating Reverse voltage Junction temperature Collector-emitter voltage Emitter-collector voltage Detector Collector current Power dissipation(single circuit) Power dissipation derating (Ta 25C)(single circuit) Junction temperature Operating temperature range Storage temperature range Lead soldering temperature (10s) Total package power dissipation Total package power dissipation derating (Ta 25C) Isolation voltage (Note 4) (Note 3) Symbol IF IF / C IFP PD PD / C VR Tj VCEO VECO IC PC PC / C Tj Topr Tstg Tsol PT PT / C BVS Rating 60 -0.7 1 100 -1.0 5 125 80 7 50 150 -1.5 125 -55~110 -55~125 260 250 -2.5 5000 Unit mA mA / C A mW mW / C V C V V mA mW mW / C C C C C mW mW / C Vrms
(Note): Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings. Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook ("Handling Precautions"/"Derating Concept and Methods") and individual reliability data (i.e. reliability test report and estimated failure rate, etc). (Note 3): 100s pulse, 100Hz frequency (Note 4): AC, 1 min., R.H. 60%. Apply voltage to LED pin and detector pin together.
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TLP781/TLP781F
Recommended Operating Conditions
Characteristic Supply voltage Forward current Collector current Operating temperature Symbol VCC IF IC Topr Min -25 Typ. 5 16 1 Max 24 25 10 85 Unit V mA mA C
(Note): Recommended operating conditions are given as a design guideline to obtain expected performance of the device. Additionally, each item is an independent guideline respectively. In developing designs using this product, please confirm specified characteristics shown in this document.
Individual Electrical Characteristics (Ta = 25C)
Characteristic Forward voltage LED Reverse current Capacitance Collector-emitter breakdown voltage Emitter-collector breakdown voltage Symbol VF IR CT V(BR) CEO V(BR) ECO Test Condition IF = 10 mA VR = 5 V V = 0, f = 1 MHz IC = 0.5 mA IE = 0.1 mA VCE = 24 V Collector dark current ID(ICEO) VCE = 24 V Ta = 85C V = 0, f = 1 MHz Min 1.0 80 7 Typ. 1.15 30 0.01 0.6 10 Max 1.3 10 0.1 50 Unit V A pF V V A A pF
Detector
Capacitance (collector to emitter)
CCE
Coupled Electrical Characteristics (Ta = 25C)
Characteristic Current transfer ratio Symbol IC / IF Test Condition IF = 5 mA, VCE = 5 V Min 50 Rank GB 100 Rank GB 30 Rank GB Typ. 60 0.2 Max 600 600 0.4 0.4 V Unit %
Saturated CTR
IC / IF (sat)
IF = 1 mA, VCE = 0.4 V IC = 2.4 mA, IF = 8 mA
%
Collector-emitter saturation voltage
VCE (sat)
IC = 0.2 mA, IF = 1 mA
Isolation Characteristics (Ta = 25C)
Characteristic Capacitance (input to output) Isolation resistance Symbol CS RS Test Condition VS = 0, f = 1 MHz VS = 500 V AC, 1 minute Isolation voltage BVS AC, 1 second, in oil DC, 1 minute, in oil Min 1x10
12
Typ. 0.8 10
14
Max
Unit pF Vrms Vdc
5000
10000 10000
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TLP781/TLP781F
Switching Characteristics (Ta = 25C)
Characteristics Rise time Fall time Turn-on time Turn-off time Turn-on time Storage time Turn-off time Symbol tr tf ton toff tON ts tOFF RL = 1.9 k VCC = 5 V, IF = 16 mA (Note 5) VCC = 10 V, IC = 2 mA RL = 100 Test Condition Min Typ. 2 3 3 3 2 25 50 Max s s Unit
IF IF
RL
VCC VCE VCE
ts
VCC 4.5V 0.5V
tON
tOFF
(Note 5): Switching time test circuit
Surface-Mount Lead Form Options
TLP781(LF6) TLP781F(LF7)
Unit in mm
Unit in mm
TOSHIBA
TOSHIBA Weight : 0.24g (typ.)
Weight : 0.24g (typ.)
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TLP781/TLP781F
Specifications for Embossed-Tape Packing: (TP6), (TP7)
1. Applicable Package
Package Name DIP4LF6 DIP4LF7 Product Type TLP781 TLP781F
2. Product Naming System
Type of package used for shipment is denoted by a symbol suffix after a product number. The method of classification is as below. (Example 1) Tape type CTR rank Device name (Example 2) F Tape type CTR rank Device name
3. Tape Dimensions
3.1 Orientation of Device in Relation to Direction of Tape Movement
Device orientation in the recesses is as shown in Figure 1.
Tape feed
Figure1 Device Orientation 3.2 Tape Packing Quantity:2000 devices per reel 3.3 Empty Device Recesses Are as Shown in Table 1. Table1 Empty Device Recesses
Standard Occurrences of 2 or more successive empty device recesses Single empty recesses device Remarks Within any given 40-mm section of tape, not including leader and trailer Not including leader and trailer
0
6 devices (max.) per reel
3.4 Start and End of Tape
The start of the tape has 30 or more empty holes. The end of the tape has 50 or more empty holes.
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TLP781/TLP781F
3.5 Tape Specification
[1] TLP781 (TP6) (1)Tape material: Plastic (2)Dimensions: The tape dimensions are as shown in Figure 2. 2.00.1 0.330.02 1.5 +0.1 -0 8.00.1 4.00.1 1.750.1 10.60.1 7.50.1 16.0 -0.1 11.50.1 1.750.1 12.350.1
+0.2
1.5 +0.2 -0 4.20.1 4.450.1
Figure 2 Tape Forms
[2] TLP781F (TP7) (1)Tape material: Plastic (2)Dimensions: The tape dimensions are as shown in Figure 3.
2.00.1 0.330.02 1.5 +0.1 -0 8.00.1 4.00.1
4.40.1
1.5 +0.25 -0
5.050.1
Figure 3 Tape Forms
6
24.0 -0.1
+0.3
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TLP781/TLP781F
3.6 Reel Specification
[1] TLP781 (TP6) (1)Material: Plastic (2)Dimensions: The reel dimensions are as shown in Figure 4. 3.60.8 16.4 -0
+2.0
13.00.5
1.50.5
23max
Unit: mm
Figure 4 Reel Forms
[2] TLP781F (TP7) (1)Material: Plastic (2)Dimensions: The reel dimensions are as shown in Figure 5. 4.00.3
24.4 -0
+2.0
1021.5
1001.5 31max
332 max 330 max
1.90.5
Figure 5 Reel Forms
4. Packing
One reel of photocouplers is packed in a shipping carton.
5. Label Indication
The carton bears a label indicating the product number, the symbol representing classification of standard, the quantity, the lot number and the Toshiba company name.
6. Ordering Information
When placing an order, please specify the product number, the CTR rank, the tape type and the quantity as shown in the following example. (Example) 2000Pcs. Quantity (must be a multiple of 2000) Tape type CTR rank Device name (Note): The order code may be suffixed with wither a letter or a digit. Please contact your nearest Toshiba sales representative for more details.
13.00.5
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TLP781/TLP781F
Soldering and Storage
1. Soldering
1.1 Soldering When using a soldering iron or medium infrared ray/hot air reflow, avoid a rise in device temperature as much as possible by observing the following conditions.
1) Using solder reflow *Temperature profile example of lead (Pb) solder
(C) 240
Package surface temperature
210
160 140
This profile is based on the device's maximum heat resistance guaranteed value. Set the preheat temperature/heating temperature to the optimum temperature corresponding to the solder paste type used by the customer within the described profile.
60120s
less than 30s
Time
(s)
*Temperature profile example of using lead (Pb)-free solder
(C) 260
Package surface temperature
230
190 180
This profile is based on the device's maximum heat resistance guaranteed value. Set the preheat temperature/heating temperature to the optimum temperature corresponding to the solder paste type used by the customer within the described profile.
60120s
3050s
Time
(s)
2) Using solder flow (for lead (Pb) solder, or lead (Pb)-free solder) Please preheat it at 150C between 60 and 120 seconds. Complete soldering within 10 seconds below 260C. Each pin may be heated at most once. 3) Using a soldering iron Complete soldering within 10 seconds below 260C, or within 3 seconds at 350C. Each pin may be heated at most once.
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TLP781/TLP781F
2. Storage
1) Avoid storage locations where devices may be exposed to moisture or direct sunlight. 2) Follow the precautions printed on the packing label of the device for transportation and storage. 3) Keep the storage location temperature and humidity within a range of 5C to 35C and 45% to 75%, respectively. 4) Do not store the products in locations with poisonous gases (especially corrosive gases) or in dusty conditions. 5) Store the products in locations with minimal temperature fluctuations. Rapid temperature changes during storage can cause condensation, resulting in lead oxidation or corrosion, which will deteriorate the solderability of the leads. 6) When restoring devices after removal from their packing, use anti-static containers. 7) Do not allow loads to be applied directly to devices while they are in storage. 8) If devices have been stored for more than two years under normal storage conditions, it is recommended that you check the leads for ease of soldering prior to use.
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TLP781/TLP781F
EN60747 Isolation Characteristics
Types: TLP781, TLP781F Type designations for `option: (D4) ', which are tested under EN60747 requirements. Ex.: TLP781 (D4-GR-LF6) D4: EN60747 option GR: CTR rank name LF6: standard lead bend name Note: Use TOSHIBA standard type number for safety standard application. Ex. TLP781 (D4-GR-LF6) TLP781
Description Application classification for rated mains voltage 300 Vrms for rated mains voltage 600 Vrms Climatic classification Pollution degree Maximum operating insulation voltage Input to output test voltage, Vpr = 1.5xVIORM, type and sample test tp = 10s, partial discharge < 5pC Input to output test voltage, Vpr = 1.875xVIORM, 100% production test tp = 1s, partial discharge < 5pC Highest permissible overvoltage (transient overvoltage, tpr = 60s) Safety limiting values (max. permissible ratings in case of fault) current (input current IF, Psi = 0) power (output or total power dissipation) temperature Insulation resistance, VIO = 500V,Ta=25 VIORM I-IV I-III 55 / 115 / 21 2 890 Symbol Rating Unit
Vpk
Vpr
1335
Vpk
Vpr VTR
1670
Vpk
6000
Vpk
Isi Psi Tsi Rsi
300 500 150 10
12
mA mW C
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TLP781/TLP781F
Insulation Related Specifications
7.62mm pitch TLPxxx type Minimum creepage distance Minimum clearance Minimum insulation thickness Comparative tracking index Cr Cl ti CTI 6.5mm 6.5mm 0.4 mm 175
10.16mm pitch TLPxxxF type 8.0mm 8.0mm
(1)
If a printed circuit is incorporated, the creepage distance and clearance may be reduced below this value. (e.g.at a standard distance between soldering eye centres of 7.5mm). If this is not permissible, the user shall take suitable measures. This photocoupler is suitable for `safe electrical isolation' only within the safety limit data. Maintenance of the safety data shall be ensured by means of protective circuits.
(2)
VDE test sign: Marking on product for EN60747
4
Marking on packing for EN60747
Marking Example: TLP781, TLP781F
Lot No.
P
Device Name CTR Rank Marking 4: Mark for option (D4)
1pin indication
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TLP781/TLP781F
IF - Ta
100
200
PC - Ta
Allowable forward current IF (mA)
60
Allowable collector power dissipation PC (mW)
80
160
120
40
80
20
40
0 -20 0 20 40 60 80 100 120
0 -20
0
20
40
60
80
100
120
Ambient temperature Ta ()
Ambient temperature Ta ()
-3.0
VF / Ta
- IF
100.0
IF - VF
Forward voltage temperature coefficient VF / Ta (mV / )
Forward current IF
0.1 0
-2.2
(mA)
10.0 1.0 0.1
-2.6
-1.8
-1.4
-1.0
-0.6 1 10 100
0.40
0.60
0.80
1.00
1.20
1.40
1.60
Forward current
IF
(mA)
Forward voltage VF
(V)
IFP - VFP
1000
Pulse width 10s Repetitive frequency=100Hz Ta = 25
Pulse forward current IFP (mA)
100
10
1 0.00 0.40 0.80 1.20 1.60 2.00 2.40
Pulse forward voltage
VFP (V)
*: The above graphs show typical characteristics.
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TLP781/TLP781F
ID - Ta
10
IC - VCE
80
(A)
(mA) Collector current IC
1
60
Collector dark current IC
0.1
50
40
30 20 15 10
0.01
20
5 IF= 2 mA
0.001
0
0.0001 0 20 40 60 80 100
0
2
4
6
8
10
Ambient temperature Ta
()
Collector-emitter voltage
VCE (V)
30
IC - VCE
100.00
IC - IF
(mA)
50
20
Collector current IC
30 20 15 10
10
10.00
5
Collector current IC
(mA)
1.00
0.8 1.0 1.2
IF= 2 mA
0 0.0 0.2 0.4 0.6
Collector-emitter voltage
VCE (V)
0.10
IC /IF - IF
1000
IC / IF (%)
Ta = 25C VCE = 5V VCE = 0.4V
0.01
100
0.1
1
10
100
Current transfer ratio
Forward current IF
(mA)
10
Ta = 25C VCE = 5V VCE = 0.4V
1 0.1 1 10 100
Forward current IF
(mA)
*: The above graphs show typical characteristics.
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TLP781/TLP781F
IC - Ta
100
20mA
VCE(sat) - Ta
0.20
VCE = 5V
0.16
IF = 5 mA IC = 1 mA
Collector current IC (mA)
5mA
10
Collector-emitter saturation voltage VCE(sat) (V)
10mA
0.12
1mA
0.08
1
IF= 0.5 mA
0.04
0.1 0
0.00
-40 -20 0 20 40 60 80 100
-40
-20
0
20
40
60
80
100
Ambient temperature
Ta ()
Ambient temperature
Ta ()
Switching Time - RL
1000
Ta = 25C IF = 16mA VCC = 5V
tOFF
100
Switching time (s)
tS
10
tON
1 1 10 100
Load resistance RL (k)
*: The above graphs show typical characteristics.
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TLP781/TLP781F
RESTRICTIONS ON PRODUCT USE
* The information contained herein is subject to change without notice.
20070701-EN
* TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of such TOSHIBA products could cause loss of human life, bodily injury or damage to property. In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and conditions set forth in the "Handling Guide for Semiconductor Devices," or "TOSHIBA Semiconductor Reliability Handbook" etc. * The TOSHIBA products listed in this document are intended for usage in general electronics applications (computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances, etc.).These TOSHIBA products are neither intended nor warranted for usage in equipment that requires extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or bodily injury ("Unintended Usage"). Unintended Usage include atomic energy control instruments, airplane or spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments, medical instruments, all types of safety devices, etc.. Unintended Usage of TOSHIBA products listed in his document shall be made at the customer's own risk. * The products described in this document shall not be used or embedded to any downstream products of which manufacture, use and/or sale are prohibited under any applicable laws and regulations. * The information contained herein is presented only as a guide for the applications of our products. No responsibility is assumed by TOSHIBA for any infringements of patents or other rights of the third parties which may result from its use. No license is granted by implication or otherwise under any patents or other rights of TOSHIBA or the third parties. * GaAs(Gallium Arsenide) is used in this product. The dust or vapor is harmful to the human body. Do not break, cut, crush or dissolve chemically. * Please contact your sales representative for product-by-product details in this document regarding RoHS compatibility. Please use these products in this document in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances. Toshiba assumes no liability for damage or losses occurring as a result of noncompliance with applicable laws and regulations.
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